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SMD FYLS 1204BUHY/UYGC 04BUHY FYLS - 1204BUHY/UYGC Features: Compatible with automatic placement equipment Compatible with reflow solder process. Radiation pattern. Applications: Automotive-Telecommumication Indicators Lcd Back-lights Illuminations Descriptions: Dice material: RAlGaAs. GAlGaAs. Emitting Color: RRed GGreen Lens Color: Water clear. Relative Lumionous Intensity(LOP @max=1) ratings(Ta=25 =25 Absolute maximun ratings(Ta=25) Parameter Power Dissipation Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) Continuous Forward Current Derating Linear From 25 Operating Temperature Range Storage Temperature Range MAX. Unit 50 100 30 0.4 mW mA mA mA/ -30 to +80 85 -40 to +85 characteristics(Ta=25 Electrical and optical characteristics(Ta=25) Parameter Luminous Intensity Viewing Angle Peak Emission Wavelength Dominant Wavelength Spectral Line Half-Width Forward Voltage Reverse Current Symbol IV R G Min. --100 -565 635 566 25 Typ. 60 50 110 660 570 640 571 30 2.1 2.3 Max. --120 -575 650 576 35 2.4 2.4 10 Unit mcd Deg nm Test Condition 21/2 p R G R G IF=20mA nm nm V A VR=5V d VF IR R G --- SMD Curves Typical Electrical Characteristics Curves (25 (25 Ambient Temperature Unless Otherwise Noted) Spectral (1) Reduance (2) Response (1)peak@568nm (2)peak@660nm Normalized /yellow / Orange Green Wave Length(nm) Forward Current Vs Forward Voltage 50 Relative Luminous intensity vs Forward current 3.0 Relative Intensity (Lop@20mA=1) Forward Current(mA) 40 2.5 2.0 1.5 1.0 0.5 0 50 30 20 10 0 1.7 1.8 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3 3.5 0 10 Forward Voltage(V) Forward 20 Current 30 IF(mA) 40 Forward Current Derating Curve 60 Forward Current(mA) 50 40 30 20 10 0 0 10 20 30 40 50 60 70 80 90 InGaN/SiC AlGaInP GaP/GaP Relative Luminous Intensity Luminous Intensity Vs. Ambient Temperature 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 80 100 I n G a N / A l2 O 3 Ambient Temperature TA( C) Ambient Temperature TA( C ) SMD Precautions For Use Over-current-proof Customer must apply resistors for protection,otherwise slight voltage shift will cause big current chang(Burn out will happen) Storage 1. The operation of temperature and R.H are:5 ---30,R.H.60% Max. 2. Once the package is opened ,the products should be used within a week. Otherwise,they Should be kept in a dampproof box with desccating regent.Considering the tape life,we Suggest our customers to use our products within 1.5year (form production date). 3. It's recommended to bake before soldering when the package is unsealed after 72hrs.The Condition is: 60 5 for 15 hrs. Soldering Iron: Temperature at tip of iron:300 Max.(25W Max) Soldering time:31sec. Reflow Temp./Time: Temperature Time SMD Package Package Dimensions of Device Soldering Terminal 1.0 Cathode mark 0.65 5.0 1.0 LED Die 3.2 PCB only tor fixed Resin 1.5 2.0 1.5 0.5 1.5 0.65 Unit:mm Tape Specification: 3000pcs Per Reel. Packing Item Spec. Tolerance Item Spec. Tolerance W P1 E F Size D0 D1 P0 1.0 0.9 Unit mm mm 8.00 0.20 10P0 40.00 0.20 4.00 0.10 P2 2.00 0.05 1.75 0.10 A0 2.80 0.10 3.50 0.05 B0 3.35 0.10 1.50 +0.1/-0 K0 1.65 0.10 1.00 0.05 T 0.23 0.05 4.00 0.05 Unit mm mm Cathode D0 P2 P0 A' E K0 5 P1 A0 A' SEC:A-A' Package Dimensions of Reel: 60+0.5/-0 13.50.2 1781.0 Unit:mm 120.15 90.1 B0 t D1 F W SMD Packing and Shipping Spec. L1 sb sb Zip-lock Desiccant Antistatic Bag W1 Desiccant Spec. Spec. 203.0. Spec. 198.0 Unit:mm Box Dimension(cm):30 * 19* 11.5 ) cs (p TY Q' . NO RT PA 10 Reels per box CARTON Dimension(cm):39*32*38 6boxs/carton 0603B/0603/0805: 4000pcs*10Reels*6boxs 0805B/1206B/1206 1210/1204: 3000pcs*10Reels*6boxs* 3528:2000pcs*10Reels*6boxs 5050:1000pcs*8Reels*6boxs S KG S KG CM 38 1* *3 38 S: EA M W G. W N. C/NO |
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